人才培育如建「足球隊」 黃錦輝解讀香港保持競爭力關鍵

今年是國家「十五五」規劃的開局之年,規劃綱要為未來五年經濟社會發展描繪了藍圖,也為香港融入國家發展大局提供了清晰指引。在本集《穎聞天下》中,我們邀請到黃錦輝教授——他是計算機科學家、公共政策實踐者、立法會議員,也是香港中文大學工程學院副院長。
 
 
Date: 
Thursday, June 18, 2026
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dotdotnews.com

AI與教育未來:學生、老師、家長該怎麼準備?

立法會議員兼中文大學工程學院副院長(外務)黃錦輝教授認為,所有學生都要做好準備,利用AI深度地學習。他指出,過往學習的三個階段,即「教、學、評」由老師主導,但有了AI之後,學生可更自主學習。黃教授指AI的出現,將會改變評核的方式,由以往派試卷作答,改為向學生提供開源AI程式。

Date: 
Saturday, June 20, 2026
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tvb.com

大專機械人賽港大膺「武林至尊」 8月聯同中大主場出戰國際賽

學界年度創科盛事「全港大專生機械人大賽2026」昨日圓滿落幕。今年比賽致敬中國傳統功夫,以「武林至尊」為主題,吸引江湖上9間大專院校組成15支精英隊伍,一較高下。經過連場激烈比併,最終由香港大學團隊「格物」脫穎而出,勇奪「武林至尊」寶座。
 
Date: 
Tuesday, June 23, 2026
Media: 
stheadline.com

【院士領航香江科創】港科研具獨特引領力 聚焦對接國家工程 發揮「前沿基礎研究引擎」與「高水平國際合作樞紐」雙關鍵作用

在國家「十五五」規劃建設科技強國的路上,包括高端裝備、航空航天等戰略性新興產業發展是其中一個重要基礎。獲選2025年中國工程院外籍院士的香港中文大學卓敏機械與自動化工程學研究教授、國際著名控制理論及智慧計算與飛行器制導專家黃捷早前接受香港文匯報專訪,細談香港於國家創新體系中的角色。

Date: 
Monday, June 22, 2026
Media: 
wenweipo

CUHK develops all-optical signal processor to break AI data centre transmission bottleneck

Date: 
2026-06-22
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A research team led by Professor Huang Chaoran from Department of Electronic Engineering has developed a novel integrated all-optical signal processor (OSP) to address the massive data transmission demands of next-generation AI systems, particularly for high-speed links between multiple data centres.

Built on a silicon photonic chip, the OSP processes optical signals directly in the light domain, correcting distortions in real time without converting them into electrical signals. This approach significantly improves transmission speed, reduces latency and lowers energy consumption compared with conventional digital signal processing (DSP).

Experimental results demonstrate that the OSP achieves an aggregate data rate of 1.6 Tb/s with latency below 60 picoseconds and energy consumption of only tens of femtojoules per bit. These results address key performance bottlenecks in current communication technologies and offer a promising solution for ultra‑low‑latency, energy‑efficient AI computing. The findings have recently been published in the leading international academic journal Science.

Rapid AI growth drives demand for high-speed transmission across large-scale distributed data centres

As AI systems increasingly rely on distributed computing across multiple data centres, fast and reliable data exchange has become critical. However, conventional electronic signal processing struggles to keep up with rising transmission speeds and associated signal distortions.

“Optical fibre communications form the backbone of modern data transmission and data centre interconnect technologies. However, conventional data centre interconnect technologies are increasingly struggling to keep pace with the scale and speed required by modern AI systems,” said Professor Huang Chaoran, Assistant Professor in the Department of Electronic Engineering, CUHK. “As transmission rates continue to rise, signal distortion becomes more severe, and if signal processing still relies on electronic methods, it can also introduce severe latency and significant power consumption.”

Correcting distorted signals directly with light for greater efficiency

To address these challenges, Professor Huang’s team, together with researchers from Huazhong University of Science and Technology (HUST) and Fudan University (FDU), has developed the programmable OSP, which can flexibly compensate for various signal impairments, including chromatic dispersion and nonlinear distortions. Its design draws inspiration from neuromorphic computing and machine learning, enabling more accurate signal correction.

The OSP also demonstrates strong scalability and adaptability across different transmission conditions, wavelengths and data formats, and has the potential to significantly expand optical fibre capacity.

This research marks an important step forward in optical communication, highlighting a future where light is used not only to transmit but also to process information, advancing next‑generation communication and computing technologies.

 

More details: https://www.cpr.cuhk.edu.hk/en/press/cuhk-develops-all-optical-signal-processor-to-break-ai-data-centre-transmission-bottleneck-delivering-1-6-tb-s-throughput-and-sub-60-picosecond-latency-to-enable-green-ai-supercomputing/

 

More information about the research: Professor Huang Chaoran is the corresponding author. Other contributing authors of this work include Wang Benshan (first author), Xiao Qiarong (co-first author), Xu Tengji, Fan Li and Liu Shaojie from CUHK; and collaborators (Professor Kong Qiuqiang from CUHK, Professor Dong Jianji from HUST, and Professor Zhang Junwen from FDU). The full text can be found at https://www.science.org/doi/10.1126/science.ady5344.

A research team led by CUHK has developed a novel integrated all-optical signal processor (OSP) to address the massive data transmission demands of next-generation AI systems. Team members include Assistant Professor in the Department of Electronic Engineering Professor Huang Chaoran (front row middle), PhD students Wang Benshan (back row, 3rd left) and Xiao Qiarong (front row, 1st left).

Distributed data centres rely on high-speed optical interconnects to support large-scale AI. However, as transmission speeds continue to increase, signal distortion, latency and power consumption pose major challenges. The OSP developed by the CUHK-led team can correct distortions in real time before the optical signal is converted into an electrical signal. With a latency below 60 picoseconds and extremely low energy consumption, it can help increase transmission capacity and accelerate AI training across data centres.

The OSP architecture comprises three photonic reservoirs and eight readout channels. By precisely tuning the optical delay lines on the chip, the research team enables the system to achieve extremely high temporal sampling resolution, allowing it to process high-speed optical signals more effectively.

The packaged OSP chip with electrical wire bonds and an optical fibre array.

Comparison of the OSP’s chromatic dispersion compensation performance.

(Left) Under the test conditions, the OSP corrects signal distortion more effectively than conventional DSP-based methods.

(Right) Compared with previously reported optical processors, the OSP enables high-speed data processing at the 200 Gbit/s per channel level.Compensation performance of the OSP under bandwidth limitations and nonlinear effects.

(A–F) Experimental results show that signal impairments and device bandwidth limitations degrade signal quality. After applying the OSP, the signals become significantly clearer and of higher quality.

(G–H) Under nonlinear effects (such as high-power transmission), the OSP performs better than conventional DSP-based methods.

Validation of OSP programmability, demonstrating its ability to adapt flexibly to different transmission conditions.

(A–D) The OSP maintains good signal quality across different wavelengths, data rates and modulation formats.

(E) The system can operate stably after simple training.

(F) The OSP can be adjusted according to different application requirements, showing strong flexibility.

The OSP supports high-speed data centre interconnect transmission with a total rate of up to 1.6 Tb/s

(A) An illustration of a high-speed optical transceiver integrated with the OSP, which can simultaneously process eight wavelength channels and correct distorted optical signals.

(B) Compared with unprocessed transmission or conventional methods, the OSP significantly reduces transmission errors.

(C) When combined with a small amount of DSP, the OSP can further improve long-distance transmission performance.

 

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CHENG Guangyao
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程广耀
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CUHK and HKIE sign MOU for launching the EngSeeds programme

Date: 
2026-06-08
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CUHK Faculty of Engineering and the Hong Kong Institution of Engineers (HKIE) have signed a Memorandum of Understanding to officially launch the “EngSeeds” programme for secondary school students. The programme aims to provide secondary school students with a systematic and inspiring engineering practice experience, helping them understand the engineering profession and plan their future academic and career development.

HKIE, in collaboration with partner universities and institutions, is launching a diverse range of experiential activities, including interactive workshops, industry sharing sessions, and experiential learning. These activities cover cutting-edge fields such as construction and infrastructure, artificial intelligence, robotics, ESG (Environmental, Social, and Governance), and biomedicine, allowing students to engage with engineering and STEAM knowledge in real-world engineering environments, inspiring creative thinking and cultivating problem-solving skills. The first round of activities will be held from June to September this year. Students who complete the entire program will receive a certificate jointly issued by the Society and partner institutions to recognize their learning outcomes.

More details: HKIE press release 

 

 

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Two Engineering students awarded Innovation and Technology Scholarships

Date: 
2026-06-05
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Two students from CUHK Faculty of Engineering have been awarded the Innovation and Technology Scholarship 2026. Established to recognise talented students with a passion for innovation and technology, the scholarship provides valuable opportunities to broaden their international perspectives and gain industry experience, encouraging them to pursue careers in the I&T sector.

Each awardee will receive up to HK$150,000 for participating in a series of elite training programmes, including the overseas/ Chinese Mainland attachment programme, the mentorship programme, the local internship programme, the service project programme, as well as the ideations and achievements showcase.

Among the six CUHK awardees, Cheung Yu-yan, a Year 3 student in the Bachelor of Engineering in Biomedical Engineering plans to use the scholarship to explore digital living technologies, with a focus on the design of elderly‑friendly assistive devices and creative ideation projects that address the practical needs of elderly users. She said: “My core aspiration is to become a people-centric innovator in gerontechnology. I want to bridge academic research, clinical practice and the real, often unspoken needs of Hong Kong’s ageing population.”

Lam Kwan‑Tung, a Year 3 Bachelor of Engineering student in Artificial Intelligence: Systems and Technologies, will undertake a six-month research attachment at ETH Zurich, Switzerland, in collaboration with the Nvidia AI Technology Centre, supported by the scholarship. She said: “This scholarship holds profound significance to me, as it offers an opportunity to connect and collaborate with brilliant minds across disciplines and institutions and to immerse myself in one of the world’s most dynamic research environments, bridging the best of academia and industry.”

 

About the Innovation and Technology Scholarship

The Innovation and Technology Scholarship was established by the Innovation and Technology Commission of the Hong Kong Government, The Hongkong and Shanghai Banking Corporation Limited and The Hong Kong Federation of Youth Groups in 2011. Awardees are nominated by their universities and then selected by an Awardee Selection Committee with members from different sectors. There are 25 awardees per year.

More details: https://www.cpr.cuhk.edu.hk/en/press/six-cuhk-students-awarded-innovation-and-technology-scholarships-highest-among-participating-institutions/

CUHK representatives and CUHK awardees of the Innovation and Technology Scholarship 2026

Professor Sun Dong (right), Secretary for Innovation, Technology and Industry of the Hong Kong Special Administrative Region of the People’s Republic of China, presents the Innovation and Technology Scholarship to Cheung Yu-yan

Professor Sun Dong (right), Secretary for Innovation, Technology and Industry of the Hong Kong Special Administrative Region of the People’s Republic of China, presents the Innovation and Technology Scholarship to Lam Kwan-tung

 

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中大6名傑出學生獲頒2026創新科技獎學金 為參與院校之冠

香港中文大學(中大)共有六名傑出學生獲頒「2026年創新科技獎學金」,成為所有參與院校之冠。該獎學金旨在表揚對創新科技充滿熱誠的年青人才,並透過多元培訓與實踐機會,協助他們擴闊國際視野、累積業界經驗,鼓勵日後投身創科領域發展。

Date: 
Thursday, June 4, 2026
Media: 
wenweipo
Name: 
XUE Diwen
Title ( post ): 
Assistant Professor
Department: 
Information Engineering
email: 
dwxue[at]ie.cuhk.edu.hk
phone: 
3943 5155
website: 
https://www.ie.cuhk.edu.hk/faculty/xue-diwen/
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薛棣文
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