The Chinese University of Hong Kong (CUHK) receives approval from the Innovation and Technology Commission (ITC) of the HKSAR Government to establish a new research center, in collaboration with National University of Singapore, under the third InnoHK research cluster, SEAM@InnoHK. This research center, The Center for Heterogeneous Integration and Production (CHIP), is led by Professor Shih-Chi Chen (Director, Department of Mechanical and Automation Engineering, CUHK), Professor Jianbin Xu (Co-Director, Department of Electronic Engineering, CUHK), and Professor Ni Zhao (Associate Director, Department of Electronic Engineering, CUHK). CHIP is dedicated to advancing next-generation electronics through innovations in semiconductor equipment and material processing, with a focus on advancing heterogeneous integration technologies. As the semiconductor industry moves beyond Moore’s Law, 3D heterogeneous integration has become essential for enhancing the performance and functionality of modern electronics. Constructing silicon 3D-ICs at the nanoscale requires highly precise tools that are currently unavailable, while the integration of emerging semiconductors—such as 2D materials, metal oxides, and mixed ionic–electronic conductors—demands new equipment and scalable fabrication processes. CHIP’s research is structured into three synergistic research programs, each with a distinct focus and objective: Research Program 1 focuses on developing enabling precision fabrication and metrology equipment, including wafer bonding systems, 2D lithography platforms, and laser etching machines, to set new benchmarks in speed, accuracy, and scalability for 3D and photonic ICs. Research Program 2 focuses on foundational material engineering and advanced packaging solutions, including bonding technology, chip cooling, and 2D material integration, enabling heterogeneous integration at industrial scale. Research Program 3 targets the creation of new devices and systems enabled by heterogeneous integration, including electronic-photonic co-ICs, back-end-of-line (BEOL)-compatible devices, 2D material-silicon hybrid optoelectronic chips, and flexible sensing modules. Together, these programs align closely with the roadmap of global heterogeneous integration development, addressing critical challenges in semiconductor manufacturing while enabling new applications in AI, high-performance computing, robotics, AR/VR, and beyond. CHIP’s mission is to overcome these challenges by delivering impactful, real-world solutions that enhance efficiency, scalability, and sustainability, positioning Hong Kong and Chinese Mainland as global leaders in advanced manufacturing and electronic materials. |
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